Sputtering targets which classified by shape divides into Rectangular plane target, circular plane target and cylindrical target.

Sputtering targets which classified by ingredient divides into single metal target, alloy target and ceramic target. 

The utilization rate of plane target is relatively low, only about 30%, etched along the racetrack.

 targets cooling and target backplane

1. Target power density and target cooling: the larger the target power, the greater the 

   sputtering rate; the allowable power of the target is related to the properties and 

   cooling of the target; the target adopts direct water cooling, and the allowable target power is high.

2. Target backplane

 Applied occasion: 

 ITO,SiO2, ceramics and other brittle targets and sintered targets Sn( tin), In( indium) 

 and other soft metal targets; target of too thin is too expensive. 

Materials requirements: 

Good thermal conductivity of oxygen-free copper is common used which its thermal conductivity is better than red copper and its strength is enough. 

Too thin is easy to deform and not easy to vacuum seal. 

Structure: hollow or solid structure---magnetic steel does not bubble or bubble in cold water; 

Proper thickness. 

Too thick which is lead to consumption part of the magnetic strength; too thin is easy to deform.