Magnetron sputtering had the following two advantages: 

increasing ion density thus increase the sputtering speed; 

reducing the number of electrons bombarding parts thus reduce 

the heating of substrate due to electron bombardment.

Therefore, this technology is the main one in this thin film technology industry. 

The biggest disadvantage of magnetron sputtering cathode is that using plane target, 

the target forms sputtering channel in runway area. 

Once the channel runs through the target, the whole target is scrapped, 

so the utilization ratio of it is only 20-30%. 

However, in order to avoid this shortcoming, many targets adopt cylindrical target 

and its utilization ratio can be greatly improved.