DC magnetron sputtering: DC magnetron sputtering is based on DC secondary sputtering, 

install the magnetic resistant steel behind the target. 

It can be used to sputter and deposit conductive film,and the deposition speed is fast; 

But if the target is insulator, it will cause the surface charge accumulation of the target quickly, 

which lead to the sputtering can not be carried out. For the sputtering of the pure metal target, 

which all adopt DC magnetron sputtering, such as SUS,Ag,Cr,Cu and etc. 

Intermediate frequency magnetron sputtering, which is often used for reactive sputtering, 

such as metal oxides, carbides, etc., input a little reactive gas N2, O2,C2H2 together with 

inactive Ar2 into the vacuum cavity, so that the reactive gas and target atoms are deposited on 

the substrate together. For some hard to find block materials to make target coating or 

ceramic target after sputtering, film composition is easy to deviate from the original target composition, 

but also can be improved by reactive deposition.