Sputtering target material has the characteristics of high purity, high density, 

multi-component and uniform grain, which is generally composed of target 

blank and back plate. 

The target blank belongs to the core part of sputtering target material and 

is the target material bombarded by high-speed ion beam. 

After the target is impacted by ions, the atoms on the surface of 

the target are sputtered out and deposited on the substrate to form an electronic thin film. 

Due to the low strength of high purity metal, the sputtering target needs to complete 

the sputtering process in high voltage and high vacuum machine environment. 

The sputtering target blank of ultra-high purity metal needs to be bonded with the 

back plate through different welding processes. 

The back plate plays a main role in fixing the sputtering target, and it needs to have good 

electrical and thermal conductivity.